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News Release 6th March 2007 Antenova Gets $10 Million Investment for Growth & Expansion Antenova Ltd, the integrated antenna solutions company, announced today that it has secured $10 million further funding for growth and expansion. Antenova also announced the opening of their new U.S. R&D and Support Center in Chicago, Illinois. Greg McCray, CEO, Antenova said, “This additional investment will allow Antenova to accelerate development of our RADIONOVA® range of RF antenna modules and establish additional design centers to further penetrate and support our target markets. Antenova’s high performance antennas are designed into mobile handsets, laptop computers and other wireless devices by leading OEM companies worldwide. Our strategy is to continue to provide our OEM customers and partners with industry leading antennas and RF antenna modules and become the global supplier of choice for integrated antenna solutions.” Antenova recently announced the GPS RADIONOVA RF Antenna Module - the world’s first GPS solution in a single package, which combines a high performance and low power receiver IC with Antenova’s high efficiency single ended internally balanced antenna. GPS RADIONOVA is the first in the range of RF antenna modules, which will be followed by GSM/CDMA, 3G, dual-mode GPS/GSM and dual-mode WiFi/GSM RF antenna modules. McCray continued, “Our Chicago design and support center has just opened and is already supporting customers’ projects. Having local presence with our customers has been key to our success and plans are on target for opening locations in Shanghai, China next quarter, followed by facilities in Korea and Japan by the end of this year.” McCray concluded, “Our investors’ confidence continues to underpin Antenova’s growth strategy, and we are fortunate to have the support of such experienced investors.” Participating investors in the new investment include institutional firms Artemis, CLS, Invesco and Panmure Capital and existing shareholders Quester, Cambridge Gateway Fund and FNI Venture Capital.
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